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Chemical content 74HCT164BQ

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Type numberPackagePackage descriptionTotal product weight
74HCT164BQSOT762-1DHVQFN1417.98854 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352791661151212601235Nijmegen, Netherlands; Shanghai, China; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10357
PolymerResin systemProprietary0.0046319.900000.02573
subTotal0.02326100.000000.12930
DieDoped siliconSilicon (Si)7440-21-30.23655100.000001.31502
subTotal0.23655100.000001.31502
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700037.81837
Iron (Fe)7439-89-60.167512.400000.93120
Phosphorus (P)7723-14-00.002090.030000.01164
Zinc (Zn)7440-66-60.006980.100000.03880
subTotal6.97956100.0000038.80001
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.70182
FillerSilica -amorphous-7631-86-90.367153.490002.04101
Silica fused60676-86-08.9230684.8200049.60416
PigmentCarbon black1333-86-40.016830.160000.09357
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.63160
Epoxy resin systemProprietary0.167271.590000.92986
Phenolic resinProprietary0.236702.250001.31584
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.16382
subTotal10.52000100.0000058.48168
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00985
Nickel (Ni)7440-02-00.1612391.000000.89629
Palladium (Pd)7440-05-30.014178.000000.07880
subTotal0.17718100.000000.98494
WirePure metalCopper (Cu)7440-50-80.0502096.550000.27909
Pure metal layerGold (Au)7440-57-50.000180.350000.00101
Palladium (Pd)7440-05-30.001613.100000.00896
subTotal0.05200100.000000.28906
total17.98854100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.