Chemical content 74HCT165BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT165BQ-Q100SOT763-1DHVQFN1621.68010 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298769115912601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001001.000000.00460
FillerSilver (Ag)7440-22-40.0747675.000000.34483
PolymerAcrylic resinProprietary0.005986.000000.02759
Resin systemProprietary0.0179418.000000.08276
DieDoped siliconSilicon (Si)7440-21-30.35649100.000001.64432
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.78338
Iron (Fe)7439-89-60.196362.400000.90572
Phosphorus (P)7723-14-00.002450.030000.01132
Zinc (Zn)7440-66-60.008180.100000.03774
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.66955
FillerSilica -amorphous-7631-86-90.434103.490002.00231
Silica fused60676-86-010.5503184.8200048.66357
PigmentCarbon black1333-86-40.019900.160000.09180
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61963
Epoxy resin systemProprietary0.197771.590000.91223
Phenolic resinProprietary0.279872.250001.29089
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.12279
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07549
Nickel (Ni)7440-02-00.5035192.300002.32243
Palladium (Pd)7440-05-30.016913.100000.07800
Silver (Ag)7440-22-40.008731.600000.04026
WirePure metalCopper (Cu)7440-50-80.0562796.550000.25953
Pure metal layerGold (Au)7440-57-50.000200.350000.00094
Palladium (Pd)7440-05-30.001813.100000.00833
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.