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Chemical content 74HCT175PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT175PW-Q100SOT403-1TSSOP1667.92978 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300786118612601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.3895077.900000.57339
PolymerAcrylic resinProprietary0.0760015.200000.11188
Resin systemProprietary0.034506.900000.05079
subTotal0.50000100.000000.73606
DieDoped siliconSilicon (Si)7440-21-31.21866100.000001.79400
subTotal1.21866100.000001.79400
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-837.0386097.4700054.52483
Iron (Fe)7439-89-60.912002.400001.34256
Phosphorus (P)7723-14-00.011400.030000.01678
Zinc (Zn)7440-66-60.038000.100000.05594
subTotal38.00000100.0000055.94011
Mould CompoundAdditiveNon hazardousProprietary1.251094.700001.84174
FillerSilica fused60676-86-021.0290179.0000030.95698
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.597146.000002.35116
PigmentCarbon black1333-86-40.053240.200000.07837
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.064764.000001.56744
Non hazardousProprietary1.091384.100001.60663
Tetramethylbiphenyl diglycidyl ether85954-11-60.532382.000000.78372
subTotal26.61900100.0000039.18604
Pre-PlatingPure metal layerGold (Au)7440-57-50.045003.000000.06624
Nickel (Ni)7440-02-01.3845092.300002.03813
Palladium (Pd)7440-05-30.046503.100000.06845
Silver (Ag)7440-22-40.024001.600000.03533
subTotal1.50000100.000002.20815
WirePure metalCopper (Cu)7440-50-80.09212100.000000.13561
subTotal0.09212100.000000.13561
total67.92978100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.