Chemical content 74HCT1G66GV-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT1G66GV-Q100SOT753SO510.52445 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300003125512601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0150075.000000.14253
PolymerResin systemProprietary0.0050025.000000.04751
DieDoped siliconSilicon (Si)7440-21-30.16279100.000001.54674
Lead FrameCopper alloyCopper (Cu)7440-50-83.3397894.8800031.73350
Iron (Fe)7439-89-60.089412.540000.84953
Lead (Pb)7439-92-10.001060.030000.01003
Phosphorus (P)7723-14-00.005280.150000.05017
Tin (Sn)7440-31-50.007040.200000.06689
Pure metal layerSilver (Ag)7440-22-40.077442.200000.73581
Mould CompoundFillerSilica fused60676-86-04.5085071.0000042.83834
PigmentCarbon black1333-86-40.019050.300000.18101
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2509519.7000011.88613
Phenolic resinProprietary0.571509.000005.43021
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00013
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000020.005000.00021
Tin solderTin (Sn)7440-31-50.4399699.990004.18032
WireGold alloyGold (Au)7440-57-50.0313499.000000.29782
Palladium (Pd)7440-05-30.000321.000000.00301
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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