Chemical content 74HCT221D

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Type numberPackagePackage descriptionTotal product weight
74HCT221DSOT109-1SO16144.25232 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9337151101181112601235Suzhou, China; Bangkok, Thailand; Nijmegen, NetherlandsLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01620
PolymerAcrylic resinProprietary0.0045615.200000.00316
Resin systemProprietary0.002076.900000.00143
DieDoped siliconSilicon (Si)7440-21-31.63854100.000001.13588
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-836.7218297.4700025.45666
Iron (Fe)7439-89-60.904202.400000.62682
Phosphorus (P)7723-14-00.011300.030000.00784
Zinc (Zn)7440-66-60.037680.100000.02612
Mould CompoundFillerSilica -amorphous-7631-86-90.625620.600000.43370
Silica fused60676-86-081.6746978.3300056.61933
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.360476.100004.40927
PigmentCarbon black1333-86-40.208540.200000.14457
PolymerEpoxy resin systemProprietary9.240418.862006.40573
Phenolic resinProprietary6.160275.908004.27048
Pre-PlatingPure metal layerGold (Au)7440-57-50.005651.000000.00392
Nickel (Ni)7440-02-00.5480597.000000.37992
Palladium (Pd)7440-05-30.011302.000000.00783
WirePure metalCopper (Cu)7440-50-80.07378100.000000.05115
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.