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Chemical content 74HCT251PW

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Type numberPackagePackage descriptionTotal product weight
74HCT251PWSOT403-1TSSOP1653.46381 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351883801181112601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1168577.900000.21856
PolymerAcrylic resinProprietary0.0228015.200000.04265
Resin systemProprietary0.010356.900000.01936
subTotal0.15000100.000000.28057
DieDoped siliconSilicon (Si)7440-21-30.83072100.000001.55381
subTotal0.83072100.000001.55381
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.8936397.4700037.20952
Iron (Fe)7439-89-60.489842.400000.91621
Phosphorus (P)7723-14-00.006120.030000.01145
Zinc (Zn)7440-66-60.020410.100000.03818
subTotal20.41000100.0000038.17536
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.78499
FillerSilica fused60676-86-025.0272079.0000046.81148
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.55530
PigmentCarbon black1333-86-40.063360.200000.11851
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.37020
Non hazardousProprietary1.298884.100002.42946
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.18510
subTotal31.68000100.0000059.25504
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00561
Nickel (Ni)7440-02-00.2910097.000000.54429
Palladium (Pd)7440-05-30.006002.000000.01122
subTotal0.30000100.000000.56112
WirePure metalCopper (Cu)7440-50-80.09309100.000000.17411
subTotal0.09309100.000000.17411
total53.46381100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.