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Chemical content 74HCT257PW

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Type numberPackagePackage descriptionTotal product weight
74HCT257PWSOT403-1TSSOP1663.51483 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351884001181212601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.4005080.100000.63056
PolymerResin systemProprietary0.0995019.900000.15666
subTotal0.50000100.000000.78722
DieDoped siliconSilicon (Si)7440-21-30.39914100.000000.62842
subTotal0.39914100.000000.62842
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-837.0386097.4700058.31488
Iron (Fe)7439-89-60.912002.400001.43589
Phosphorus (P)7723-14-00.011400.030000.01795
Zinc (Zn)7440-66-60.038000.100000.05983
subTotal38.00000100.0000059.82855
Mould CompoundAdditiveNon hazardousProprietary1.081004.700001.70196
FillerSilica fused60676-86-018.1700079.0000028.60749
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.380006.000002.17272
PigmentCarbon black1333-86-40.046000.200000.07242
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.920004.000001.44848
Non hazardousProprietary0.943004.100001.48469
Tetramethylbiphenyl diglycidyl ether85954-11-60.460002.000000.72424
subTotal23.00000100.0000036.21200
Pre-PlatingPure metal layerGold (Au)7440-57-50.015001.000000.02362
Nickel (Ni)7440-02-01.4550097.000002.29080
Palladium (Pd)7440-05-30.030002.000000.04723
subTotal1.50000100.000002.36165
WirePure metalCopper (Cu)7440-50-80.11569100.000000.18215
subTotal0.11569100.000000.18215
total63.51483100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.