Chemical content 74HCT259D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT259D-Q100SOT109-1SO16162.34368 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298825118712601235Suzhou, China; Shanghai, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.00960
PolymerAcrylic resinProprietary0.0030415.200000.00187
Resin systemProprietary0.001386.900000.00085
DieDoped siliconSilicon (Si)7440-21-30.49157100.000000.30280
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-854.6301297.4700033.65091
Iron (Fe)7439-89-61.345162.400000.82858
Phosphorus (P)7723-14-00.016810.030000.01036
Zinc (Zn)7440-66-60.056050.100000.03452
Mould CompoundFillerSilica -amorphous-7631-86-90.625480.600000.38528
Silica fused60676-86-081.6566878.3300050.29865
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.359076.100003.91704
PigmentCarbon black1333-86-40.208490.200000.12843
PolymerEpoxy resin systemProprietary9.238378.862005.69062
Phenolic resinProprietary6.158915.908003.79375
Pre-PlatingPure metal layerGold (Au)7440-57-50.042683.000000.02629
Nickel (Ni)7440-02-01.3132192.300000.80891
Palladium (Pd)7440-05-30.044113.100000.02717
Silver (Ag)7440-22-40.022761.600000.01402
WirePure metalCopper (Cu)7440-50-80.11421100.000000.07035
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.