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Chemical content 74HCT273D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT273D-Q100SOT163-1SO20665.27333 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301458118812601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0467477.900000.00703
PolymerAcrylic resinProprietary0.0091215.200000.00137
Resin systemProprietary0.004146.900000.00062
subTotal0.06000100.000000.00902
DieDoped siliconSilicon (Si)7440-21-30.44035100.000000.06619
subTotal0.44035100.000000.06619
Lead FrameCopper alloyCopper (Cu)7440-50-8130.8168596.0970019.66362
Iron (Fe)7439-89-63.154132.317000.47411
Lead (Pb)7439-92-10.006130.004500.00092
Phosphorus (P)7723-14-00.110270.081000.01657
Zinc (Zn)7440-66-60.167440.123000.02517
Pure metal layerGold (Au)7440-57-50.037440.027500.00563
Nickel (Ni)7440-02-01.741781.279500.26181
Palladium (Pd)7440-05-30.066700.049000.01003
Silver (Ag)7440-22-40.029270.021500.00440
subTotal136.13000100.0000020.46226
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-8130.8632297.4700019.67059
Iron (Fe)7439-89-63.222242.400000.48435
Phosphorus (P)7723-14-00.040280.030000.00605
Zinc (Zn)7440-66-60.134260.100000.02018
subTotal134.26000100.0000020.18117
Mould CompoundAdditiveNon hazardousProprietary18.527874.700002.78500
FillerSilica fused60676-86-0311.4259079.0000046.81172
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-823.652606.000003.55532
PigmentCarbon black1333-86-40.788420.200000.11851
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-615.768404.000002.37021
Non hazardousProprietary16.162614.100002.42947
Tetramethylbiphenyl diglycidyl ether85954-11-67.884202.000001.18511
subTotal394.21000100.0000059.25534
WirePure metalCopper (Cu)7440-50-80.17297100.000000.02600
subTotal0.17297100.000000.02600
total665.27333100.00000100.00000
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