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Chemical content 74HCT27BQ

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Type numberPackagePackage descriptionTotal product weight
74HCT27BQSOT762-1DHVQFN1417.94109 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352836791151312601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10385
PolymerResin systemProprietary0.0046319.900000.02580
subTotal0.02326100.000000.12965
DieDoped siliconSilicon (Si)7440-21-30.18920100.000001.05454
subTotal0.18920100.000001.05454
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700037.91839
Iron (Fe)7439-89-60.167512.400000.93366
Phosphorus (P)7723-14-00.002090.030000.01167
Zinc (Zn)7440-66-60.006980.100000.03890
subTotal6.97956100.0000038.90262
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.70632
FillerSilica -amorphous-7631-86-90.367153.490002.04641
Silica fused60676-86-08.9230684.8200049.73535
PigmentCarbon black1333-86-40.016830.160000.09382
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.63327
Epoxy resin systemProprietary0.167271.590000.93232
Phenolic resinProprietary0.236702.250001.31932
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.16954
subTotal10.52000100.0000058.63635
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00988
Nickel (Ni)7440-02-00.1612391.000000.89866
Palladium (Pd)7440-05-30.014178.000000.07900
subTotal0.17718100.000000.98754
WirePure metalCopper (Cu)7440-50-80.0501196.550000.27932
Pure metal layerGold (Au)7440-57-50.000180.350000.00101
Palladium (Pd)7440-05-30.001613.100000.00897
subTotal0.05190100.000000.28930
total17.94109100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.