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Chemical content 74HCT2G17GV

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Type numberPackagePackage descriptionTotal product weight
74HCT2G17GVSOT457SC-7410.64430 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528102812515126030 s123520 s3Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0150075.000000.14092
PolymerResin systemProprietary0.0050025.000000.04697
subTotal0.02000100.000000.18789
DieDoped siliconSilicon (Si)7440-21-30.09611100.000000.90295
subTotal0.09611100.000000.90295
Lead FrameCopper alloyCopper (Cu)7440-50-83.3491597.0768031.46425
Iron (Fe)7439-89-60.074182.150000.69685
Phosphorus (P)7723-14-00.000520.015200.00493
Zinc (Zn)7440-66-60.002000.058000.01880
Pure metal layerSilver (Ag)7440-22-40.024150.700000.22688
subTotal3.45000100.0000032.41171
Mould CompoundFillerSilica fused60676-86-04.6292071.0000043.48994
PigmentCarbon black1333-86-40.019560.300000.18376
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2844419.7000012.06693
Phenolic resinProprietary0.586809.000005.51281
subTotal6.52000100.0000061.25344
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.003000.00015
Bismuth (Bi)7440-69-90.000010.001000.00005
Copper (Cu)7440-50-80.000010.001000.00005
Lead (Pb)7439-92-10.000030.005000.00024
Tin solderTin (Sn)7440-31-50.5199599.990004.88476
subTotal0.52000100.000004.88525
WireGold alloyGold (Au)7440-57-50.0378099.000000.35515
Palladium (Pd)7440-05-30.000381.000000.00359
subTotal0.03818100.000000.35874
total10.64430100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.