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Chemical content 74HCT367PW

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Type numberPackagePackage descriptionTotal product weight
74HCT367PWSOT403-1TSSOP1664.40478 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351890501181012601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.4005080.100000.62185
PolymerResin systemProprietary0.0995019.900000.15449
subTotal0.50000100.000000.77634
DieDoped siliconSilicon (Si)7440-21-31.31506100.000002.04186
subTotal1.31506100.000002.04186
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-837.0386097.4700057.50909
Iron (Fe)7439-89-60.912002.400001.41604
Phosphorus (P)7723-14-00.011400.030000.01770
Zinc (Zn)7440-66-60.038000.100000.05900
subTotal38.00000100.0000059.00183
Mould CompoundAdditiveNon hazardousProprietary1.081004.700001.67845
FillerSilica fused60676-86-018.1700079.0000028.21219
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.380006.000002.14270
PigmentCarbon black1333-86-40.046000.200000.07142
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.920004.000001.42847
Non hazardousProprietary0.943004.100001.46418
Tetramethylbiphenyl diglycidyl ether85954-11-60.460002.000000.71423
subTotal23.00000100.0000035.71164
Pre-PlatingPure metal layerGold (Au)7440-57-50.015001.000000.02329
Nickel (Ni)7440-02-01.4550097.000002.25915
Palladium (Pd)7440-05-30.030002.000000.04658
subTotal1.50000100.000002.32902
WirePure metalCopper (Cu)7440-50-80.08973100.000000.13931
subTotal0.08973100.000000.13931
total64.40478100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.