Chemical content 74HCT373PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT373PW-Q100SOT360-1TSSOP2083.33439 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935299039118612601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.03739
PolymerAcrylic resinProprietary0.0060815.200000.00730
Resin systemProprietary0.002766.900000.00331
DieDoped siliconSilicon (Si)7440-21-30.33521100.000000.40224
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-829.7946697.4700035.75314
Iron (Fe)7439-89-60.733632.400000.88035
Phosphorus (P)7723-14-00.009170.030000.01100
Zinc (Zn)7440-66-60.030570.100000.03668
Mould CompoundFillerSilica -amorphous-7631-86-90.308880.600000.37065
Silica fused60676-86-040.3242878.3300048.38853
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.140286.100003.76829
PigmentCarbon black1333-86-40.102960.200000.12355
PolymerEpoxy resin systemProprietary4.562168.862005.47452
Phenolic resinProprietary3.041445.908003.64968
Pre-PlatingPure metal layerGold (Au)7440-57-50.023283.000000.02793
Nickel (Ni)7440-02-00.7162192.300000.85944
Palladium (Pd)7440-05-30.024053.100000.02887
Silver (Ag)7440-22-40.012421.600000.01490
WirePure metalCopper (Cu)7440-50-80.13519100.000000.16223
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.