Chemical content 74HCT377PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT377PW-Q100SOT360-1TSSOP2083.74961 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301662118712601235Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.03721
PolymerAcrylic resinProprietary0.0060815.200000.00726
Resin systemProprietary0.002766.900000.00330
DieDoped siliconSilicon (Si)7440-21-30.76890100.000000.91809
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-829.7946697.4700035.57588
Iron (Fe)7439-89-60.733632.400000.87598
Phosphorus (P)7723-14-00.009170.030000.01095
Zinc (Zn)7440-66-60.030570.100000.03650
Mould CompoundFillerSilica -amorphous-7631-86-90.308880.600000.36881
Silica fused60676-86-040.3242878.3300048.14862
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.140286.100003.74961
PigmentCarbon black1333-86-40.102960.200000.12294
PolymerEpoxy resin systemProprietary4.562168.862005.44738
Phenolic resinProprietary3.041445.908003.63159
Pre-PlatingPure metal layerGold (Au)7440-57-50.023283.000000.02780
Nickel (Ni)7440-02-00.7162192.300000.85518
Palladium (Pd)7440-05-30.024053.100000.02872
Silver (Ag)7440-22-40.012421.600000.01482
WirePure metalCopper (Cu)7440-50-80.11672100.000000.13936
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.