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Chemical content 74HCT393D

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Type numberPackagePackage descriptionTotal product weight
74HCT393DSOT108-1SO14136.44185 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9337141206531112601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-42.0025080.100001.46766
PolymerResin systemProprietary0.4975019.900000.36462
subTotal2.50000100.000001.83228
DieDoped siliconSilicon (Si)7440-21-30.57021100.000000.41791
subTotal0.57021100.000000.41791
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-863.3555097.4700046.43407
Iron (Fe)7439-89-61.560002.400001.14334
Phosphorus (P)7723-14-00.019500.030000.01429
Zinc (Zn)7440-66-60.065000.100000.04764
subTotal65.00000100.0000047.63934
Mould CompoundAdditiveNon hazardousProprietary3.196004.700002.34239
FillerSilica fused60676-86-053.7200079.0000039.37208
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.080006.000002.99028
PigmentCarbon black1333-86-40.136000.200000.09968
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.720004.000001.99352
Non hazardousProprietary2.788004.100002.04336
Tetramethylbiphenyl diglycidyl ether85954-11-61.360002.000000.99676
subTotal68.00000100.0000049.83807
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00220
Nickel (Ni)7440-02-00.2910097.000000.21328
Palladium (Pd)7440-05-30.006002.000000.00440
subTotal0.30000100.000000.21988
WirePure metalCopper (Cu)7440-50-80.07164100.000000.05251
subTotal0.07164100.000000.05251
total136.44185100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.