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Chemical content 74HCT393PW

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Type numberPackagePackage descriptionTotal product weight
74HCT393PWSOT402-1TSSOP1452.04580 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351884501181112601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1602080.100000.30781
PolymerResin systemProprietary0.0398019.900000.07647
subTotal0.20000100.000000.38428
DieDoped siliconSilicon (Si)7440-21-30.57021100.000001.09559
subTotal0.57021100.000001.09559
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-827.2916097.4700052.43766
Iron (Fe)7439-89-60.672002.400001.29117
Phosphorus (P)7723-14-00.008400.030000.01614
Zinc (Zn)7440-66-60.028000.100000.05380
subTotal28.00000100.0000053.79877
Mould CompoundAdditiveNon hazardousProprietary1.034004.700001.98671
FillerSilica fused60676-86-017.3800079.0000033.39366
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.320006.000002.53623
PigmentCarbon black1333-86-40.044000.200000.08454
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.880004.000001.69082
Non hazardousProprietary0.902004.100001.73309
Tetramethylbiphenyl diglycidyl ether85954-11-60.440002.000000.84541
subTotal22.00000100.0000042.27046
Pre-PlatingPure metal layerGold (Au)7440-57-50.012001.000000.02306
Nickel (Ni)7440-02-01.1640097.000002.23649
Palladium (Pd)7440-05-30.024002.000000.04611
subTotal1.20000100.000002.30566
WirePure metalCopper (Cu)7440-50-80.07559100.000000.14524
subTotal0.07559100.000000.14524
total52.04580100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.