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Chemical content 74HCT3G04DC

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Type numberPackagePackage descriptionTotal product weight
74HCT3G04DCSOT765-1VSSOP89.97989 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352747761251112601235Nijmegen, Netherlands; Ayutthaya, Thailand; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0287180.100000.28766
PolymerResin systemProprietary0.0071319.900000.07147
subTotal0.03584100.000000.35913
DieDoped siliconSilicon (Si)7440-21-30.12862100.000001.28875
subTotal0.12862100.000001.28875
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.3985597.0000034.05398
Nickel (Ni)7440-02-00.105113.000001.05322
subTotal3.50366100.0000035.10720
Mould CompoundAdditiveNon hazardousProprietary0.290574.700002.91154
FillerSilica fused60676-86-04.8840279.0000048.93859
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.370946.000003.71685
PigmentCarbon black1333-86-40.012360.200000.12390
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.247294.000002.47790
Non hazardousProprietary0.253474.100002.53985
Tetramethylbiphenyl diglycidyl ether85954-11-60.123652.000001.23895
subTotal6.18230100.0000061.94758
Pre-PlatingPure metal layerGold (Au)7440-57-50.003093.000000.03095
Nickel (Ni)7440-02-00.0950292.300000.95214
Palladium (Pd)7440-05-30.003193.100000.03198
Silver (Ag)7440-22-40.001651.600000.01651
subTotal0.10295100.000001.03158
WirePure metalCopper (Cu)7440-50-80.02653100.000000.26579
subTotal0.02653100.000000.26579
total9.97989100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.