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Chemical content 74HCT4020BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT4020BQ-Q100SOT763-1DHVQFN1622.07093 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935302097115612601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.36176
PolymerResin systemProprietary0.0198419.900000.08988
subTotal0.09968100.000000.45164
DieDoped siliconSilicon (Si)7440-21-30.75442100.000003.41816
subTotal0.75442100.000003.41816
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.13202
Iron (Fe)7439-89-60.196362.400000.88968
Phosphorus (P)7723-14-00.002450.030000.01112
Zinc (Zn)7440-66-60.008180.100000.03707
subTotal8.18167100.0000037.06989
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.63998
FillerSilica -amorphous-7631-86-90.434103.490001.96685
Silica fused60676-86-010.5503184.8200047.80184
PigmentCarbon black1333-86-40.019900.160000.09017
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.60865
Epoxy resin systemProprietary0.197771.590000.89607
Phenolic resinProprietary0.279872.250001.26803
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.08520
subTotal12.43847100.0000056.35679
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07415
Nickel (Ni)7440-02-00.5035192.300002.28131
Palladium (Pd)7440-05-30.016913.100000.07662
Silver (Ag)7440-22-40.008731.600000.03955
subTotal0.54551100.000002.47163
WirePure metalCopper (Cu)7440-50-80.0494296.550000.22391
Pure metal layerGold (Au)7440-57-50.000180.350000.00081
Palladium (Pd)7440-05-30.001593.100000.00719
subTotal0.05118100.000000.23191
total22.07093100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.