Chemical content 74HCT4051PW

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Type numberPackagePackage descriptionTotal product weight
74HCT4051PWSOT403-1TSSOP1663.91522 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352704181181312601235Shanghai, China; Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.4005080.100000.62661
PolymerResin systemProprietary0.0995019.900000.15567
DieDoped siliconSilicon (Si)7440-21-30.81307100.000001.27211
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-837.0386097.4700057.94958
Iron (Fe)7439-89-60.912002.400001.42689
Phosphorus (P)7723-14-00.011400.030000.01784
Zinc (Zn)7440-66-60.038000.100000.05945
Mould CompoundAdditiveNon hazardousProprietary1.081004.700001.69130
FillerSilica fused60676-86-018.1700079.0000028.42828
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.380006.000002.15911
PigmentCarbon black1333-86-40.046000.200000.07197
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.920004.000001.43941
Non hazardousProprietary0.943004.100001.47539
Tetramethylbiphenyl diglycidyl ether85954-11-60.460002.000000.71970
Pre-PlatingPure metal layerGold (Au)7440-57-50.015001.000000.02347
Nickel (Ni)7440-02-01.4550097.000002.27645
Palladium (Pd)7440-05-30.030002.000000.04694
WirePure metalCopper (Cu)7440-50-80.10215100.000000.15983
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.