Chemical content 74HCT4052BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT4052BQ-Q100SOT763-1DHVQFN1621.58806 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352988461151012601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0300060.000000.13897
ImpurityNon hazardousProprietary0.000020.039500.00009
PolymerResin systemProprietary0.0199839.951410.09253
DieDoped siliconSilicon (Si)7440-21-30.58076100.000002.69021
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700037.25937
Iron (Fe)7439-89-60.198062.400000.91744
Phosphorus (P)7723-14-00.002480.030000.01147
Zinc (Zn)7440-66-60.008250.100000.03823
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.67666
FillerSilica -amorphous-7631-86-90.434103.490002.01084
Silica fused60676-86-010.5503084.8200048.87100
PigmentCarbon black1333-86-40.019900.160000.09219
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62227
Epoxy resin systemProprietary0.197771.590000.91612
Phenolic resinProprietary0.279872.250001.29639
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.13184
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00970
Nickel (Ni)7440-02-00.1906391.000000.88302
Palladium (Pd)7440-05-30.016768.000000.07763
WirePure metalCopper (Cu)7440-50-80.0550396.550000.25492
Pure metal layerGold (Au)7440-57-50.000200.350000.00092
Palladium (Pd)7440-05-30.001773.100000.00819
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.