Chemical content 74HCT4052PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT4052PW-Q100SOT403-1TSSOP1660.77224 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352988481181012601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21791
PolymerAcrylic resinProprietary0.0258415.200000.04252
Resin systemProprietary0.011736.900000.01930
DieDoped siliconSilicon (Si)7440-21-30.58076100.000000.95564
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.77960
Iron (Fe)7439-89-60.475552.400000.78251
Phosphorus (P)7723-14-00.005940.030000.00978
Zinc (Zn)7440-66-60.019810.100000.03260
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39097
Silica fused60676-86-031.0186878.3300051.04087
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.97484
PigmentCarbon black1333-86-40.079200.200000.13032
PolymerEpoxy resin systemProprietary3.509358.862005.77460
Phenolic resinProprietary2.339575.908003.84973
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02483
Nickel (Ni)7440-02-00.4642592.300000.76392
Palladium (Pd)7440-05-30.015593.100000.02566
Silver (Ag)7440-22-40.008051.600000.01324
WirePure metalCopper (Cu)7440-50-80.10401100.000000.17115
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.