Chemical content 74HCT4060D

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Type numberPackagePackage descriptionTotal product weight
74HCT4060DSOT109-1SO16143.03746 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9337140206531012601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-42.0025080.100001.39998
PolymerResin systemProprietary0.4975019.900000.34781
DieDoped siliconSilicon (Si)7440-21-31.13042100.000000.79029
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-869.2037097.4700048.38152
Iron (Fe)7439-89-61.704002.400001.19130
Phosphorus (P)7723-14-00.021300.030000.01489
Zinc (Zn)7440-66-60.071000.100000.04964
Mould CompoundAdditiveNon hazardousProprietary3.196004.700002.23438
FillerSilica fused60676-86-053.7200079.0000037.55660
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.080006.000002.85240
PigmentCarbon black1333-86-40.136000.200000.09508
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.720004.000001.90160
Non hazardousProprietary2.788004.100001.94914
Tetramethylbiphenyl diglycidyl ether85954-11-61.360002.000000.95080
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00210
Nickel (Ni)7440-02-00.2910097.000000.20344
Palladium (Pd)7440-05-30.006002.000000.00419
WirePure metalCopper (Cu)7440-50-80.10705100.000000.07484
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.