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Chemical content 74HCT4066D

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Type numberPackagePackage descriptionTotal product weight
74HCT4066DSOT108-1SO14123.34357 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9337144601181512601235Shanghai, China; Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0779077.900000.06316
PolymerAcrylic resinProprietary0.0152015.200000.01232
Resin systemProprietary0.006906.900000.00559
subTotal0.10000100.000000.08107
DieDoped siliconSilicon (Si)7440-21-30.35253100.000000.28581
subTotal0.35253100.000000.28581
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.4131497.4700035.19692
Iron (Fe)7439-89-61.068962.400000.86665
Phosphorus (P)7723-14-00.013360.030000.01083
Zinc (Zn)7440-66-60.044540.100000.03611
subTotal44.54000100.0000036.11051
Mould CompoundAdditiveNon hazardousProprietary3.646734.700002.95656
FillerSilica fused60676-86-061.2961079.0000049.69542
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.655406.000003.77434
PigmentCarbon black1333-86-40.155180.200000.12581
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.103604.000002.51622
Non hazardousProprietary3.181194.100002.57913
Tetramethylbiphenyl diglycidyl ether85954-11-61.551802.000001.25811
subTotal77.59000100.0000062.90559
Pre-PlatingPure metal layerGold (Au)7440-57-50.006701.000000.00543
Nickel (Ni)7440-02-00.6499097.000000.52690
Palladium (Pd)7440-05-30.013402.000000.01086
subTotal0.67000100.000000.54319
WirePure metalCopper (Cu)7440-50-80.09104100.000000.07381
subTotal0.09104100.000000.07381
total123.34357100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.