Chemical content 74HCT4520D

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Type numberPackagePackage descriptionTotal product weight
74HCT4520DSOT109-1SO16139.34977 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9337153801181012601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1311577.900000.09412
PolymerAcrylic resinProprietary0.0255915.200000.01836
Resin systemProprietary0.011626.900000.00834
DieDoped siliconSilicon (Si)7440-21-32.25451100.000001.61788
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-848.6504297.4700034.91245
Iron (Fe)7439-89-61.197922.400000.85965
Phosphorus (P)7723-14-00.014970.030000.01075
Zinc (Zn)7440-66-60.049910.100000.03582
Mould CompoundAdditiveNon hazardousProprietary4.026124.700002.88922
FillerSilica fused60676-86-067.6730779.0000048.56346
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.139736.000003.68836
PigmentCarbon black1333-86-40.171320.200000.12295
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.426484.000002.45891
Non hazardousProprietary3.512154.100002.52038
Tetramethylbiphenyl diglycidyl ether85954-11-61.713242.000001.22945
Pre-PlatingPure metal layerGold (Au)7440-57-50.012791.000000.00918
Nickel (Ni)7440-02-01.2408897.000000.89048
Palladium (Pd)7440-05-30.025592.000000.01836
WirePure metalCopper (Cu)7440-50-80.07229100.000000.05188
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.