Chemical content 74HCT4852BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT4852BQ-Q100SOT763-1DHVQFN1621.90714 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298471115512601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0300060.000000.13694
ImpurityNon hazardousProprietary0.000020.039500.00009
PolymerResin systemProprietary0.0199839.951410.09118
DieDoped siliconSilicon (Si)7440-21-30.91073100.000004.15722
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700036.71668
Iron (Fe)7439-89-60.198062.400000.90407
Phosphorus (P)7723-14-00.002480.030000.01130
Zinc (Zn)7440-66-60.008250.100000.03767
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.65224
FillerSilica -amorphous-7631-86-90.434103.490001.98156
Silica fused60676-86-010.5503084.8200048.15919
PigmentCarbon black1333-86-40.019900.160000.09084
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61320
Epoxy resin systemProprietary0.197771.590000.90277
Phenolic resinProprietary0.279872.250001.27751
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.10079
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00956
Nickel (Ni)7440-02-00.1906391.000000.87016
Palladium (Pd)7440-05-30.016768.000000.07650
WirePure metalCopper (Cu)7440-50-80.0445296.550000.20323
Pure metal layerGold (Au)7440-57-50.000160.350000.00074
Palladium (Pd)7440-05-30.001433.100000.00653
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.