Chemical content 74HCT4852D

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Type numberPackagePackage descriptionTotal product weight
74HCT4852DSOT109-1SO16155.07656 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935285733118712601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2726577.900000.17582
PolymerAcrylic resinProprietary0.0532015.200000.03431
Resin systemProprietary0.024156.900000.01557
DieDoped siliconSilicon (Si)7440-21-31.27502100.000000.82219
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-854.6806797.4700035.26044
Iron (Fe)7439-89-61.346402.400000.86822
Phosphorus (P)7723-14-00.016830.030000.01085
Zinc (Zn)7440-66-60.056100.100000.03618
Mould CompoundAdditiveNon hazardousProprietary4.535834.700002.92490
FillerSilica fused60676-86-076.2405379.0000049.16316
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.790426.000003.73391
PigmentCarbon black1333-86-40.193010.200000.12446
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.860284.000002.48927
Non hazardousProprietary3.956794.100002.55151
Tetramethylbiphenyl diglycidyl ether85954-11-61.930142.000001.24464
Pre-PlatingPure metal layerGold (Au)7440-57-50.022773.000000.01468
Nickel (Ni)7440-02-00.7005692.300000.45175
Palladium (Pd)7440-05-30.023533.100000.01517
Silver (Ag)7440-22-40.012141.600000.00783
WirePure metalCopper (Cu)7440-50-80.08554100.000000.05516
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.