Chemical content 74HCT4852PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT4852PW-Q100SOT403-1TSSOP1661.08082 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298473118812601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21681
PolymerAcrylic resinProprietary0.0258415.200000.04230
Resin systemProprietary0.011736.900000.01920
DieDoped siliconSilicon (Si)7440-21-30.91073100.000001.49102
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.61905
Iron (Fe)7439-89-60.475552.400000.77855
Phosphorus (P)7723-14-00.005940.030000.00973
Zinc (Zn)7440-66-60.019810.100000.03244
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.38899
Silica fused60676-86-031.0186878.3300050.78301
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.95476
PigmentCarbon black1333-86-40.079200.200000.12966
PolymerEpoxy resin systemProprietary3.509358.862005.74542
Phenolic resinProprietary2.339575.908003.83028
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02470
Nickel (Ni)7440-02-00.4642592.300000.76006
Palladium (Pd)7440-05-30.015593.100000.02553
Silver (Ag)7440-22-40.008051.600000.01318
WirePure metalCopper (Cu)7440-50-80.08264100.000000.13529
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.