Chemical content 74HCT4852PW

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Type numberPackagePackage descriptionTotal product weight
74HCT4852PWSOT403-1TSSOP1664.35765 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935285734118512601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.4005080.100000.62230
PolymerResin systemProprietary0.0995019.900000.15460
DieDoped siliconSilicon (Si)7440-21-31.27502100.000001.98114
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-837.0386097.4700057.55120
Iron (Fe)7439-89-60.912002.400001.41708
Phosphorus (P)7723-14-00.011400.030000.01771
Zinc (Zn)7440-66-60.038000.100000.05905
Mould CompoundAdditiveNon hazardousProprietary1.081004.700001.67968
FillerSilica fused60676-86-018.1700079.0000028.23285
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.380006.000002.14427
PigmentCarbon black1333-86-40.046000.200000.07148
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.920004.000001.42951
Non hazardousProprietary0.943004.100001.46525
Tetramethylbiphenyl diglycidyl ether85954-11-60.460002.000000.71476
Pre-PlatingPure metal layerGold (Au)7440-57-50.015001.000000.02331
Nickel (Ni)7440-02-01.4550097.000002.26080
Palladium (Pd)7440-05-30.030002.000000.04661
WirePure metalCopper (Cu)7440-50-80.08264100.000000.12840
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.