Chemical content 74HCT573PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT573PW-Q100SOT360-1TSSOP2083.31266 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298868118812601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.03740
PolymerAcrylic resinProprietary0.0060815.200000.00730
Resin systemProprietary0.002766.900000.00331
DieDoped siliconSilicon (Si)7440-21-30.31140100.000000.37378
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-829.7946697.4700035.76246
Iron (Fe)7439-89-60.733632.400000.88058
Phosphorus (P)7723-14-00.009170.030000.01101
Zinc (Zn)7440-66-60.030570.100000.03669
Mould CompoundFillerSilica -amorphous-7631-86-90.308880.600000.37075
Silica fused60676-86-040.3242878.3300048.40115
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.140286.100003.76927
PigmentCarbon black1333-86-40.102960.200000.12358
PolymerEpoxy resin systemProprietary4.562168.862005.47595
Phenolic resinProprietary3.041445.908003.65063
Pre-PlatingPure metal layerGold (Au)7440-57-50.023283.000000.02794
Nickel (Ni)7440-02-00.7162192.300000.85967
Palladium (Pd)7440-05-30.024053.100000.02887
Silver (Ag)7440-22-40.012421.600000.01490
WirePure metalCopper (Cu)7440-50-80.13727100.000000.16476
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.