Chemical content 74HCT597D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT597D-Q100SOT109-1SO16162.91103 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300349118612601235Nijmegen, Netherlands; Suzhou, China; Shanghai, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.00956
PolymerAcrylic resinProprietary0.0030415.200000.00187
Resin systemProprietary0.001386.900000.00085
DieDoped siliconSilicon (Si)7440-21-31.06953100.000000.65651
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-854.6301297.4700033.53372
Iron (Fe)7439-89-61.345162.400000.82570
Phosphorus (P)7723-14-00.016810.030000.01032
Zinc (Zn)7440-66-60.056050.100000.03440
Mould CompoundFillerSilica -amorphous-7631-86-90.625480.600000.38394
Silica fused60676-86-081.6566878.3300050.12348
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.359076.100003.90340
PigmentCarbon black1333-86-40.208490.200000.12798
PolymerEpoxy resin systemProprietary9.238378.862005.67081
Phenolic resinProprietary6.158915.908003.78054
Pre-PlatingPure metal layerGold (Au)7440-57-50.042683.000000.02620
Nickel (Ni)7440-02-01.3132192.300000.80609
Palladium (Pd)7440-05-30.044113.100000.02707
Silver (Ag)7440-22-40.022761.600000.01397
WirePure metalCopper (Cu)7440-50-80.10360100.000000.06359
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.