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Chemical content 74HCU04D

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Type numberPackagePackage descriptionTotal product weight
74HCU04DSOT108-1SO14123.24882 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9337140006531512601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0779077.900000.06321
PolymerAcrylic resinProprietary0.0152015.200000.01233
Resin systemProprietary0.006906.900000.00560
subTotal0.10000100.000000.08114
DieDoped siliconSilicon (Si)7440-21-30.26494100.000000.21497
subTotal0.26494100.000000.21497
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.4131497.4700035.22398
Iron (Fe)7439-89-61.068962.400000.86732
Phosphorus (P)7723-14-00.013360.030000.01084
Zinc (Zn)7440-66-60.044540.100000.03614
subTotal44.54000100.0000036.13828
Mould CompoundAdditiveNon hazardousProprietary3.646734.700002.95884
FillerSilica fused60676-86-061.2961079.0000049.73362
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.655406.000003.77724
PigmentCarbon black1333-86-40.155180.200000.12591
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.103604.000002.51816
Non hazardousProprietary3.181194.100002.58111
Tetramethylbiphenyl diglycidyl ether85954-11-61.551802.000001.25908
subTotal77.59000100.0000062.95396
Pre-PlatingPure metal layerGold (Au)7440-57-50.006701.000000.00544
Nickel (Ni)7440-02-00.6499097.000000.52731
Palladium (Pd)7440-05-30.013402.000000.01087
subTotal0.67000100.000000.54362
WirePure metalCopper (Cu)7440-50-80.08387100.000000.06805
subTotal0.08387100.000000.06805
total123.24882100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.