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Chemical content 74LV04BQ

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Type numberPackagePackage descriptionTotal product weight
74LV04BQSOT762-1DHVQFN1418.37642 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352855661151112601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0180060.000000.09795
ImpurityNon hazardousProprietary0.000010.039500.00006
PolymerResin systemProprietary0.0119939.951410.06522
subTotal0.03000100.000000.16323
DieDoped siliconSilicon (Si)7440-21-30.62635100.000003.40846
subTotal0.62635100.000003.40846
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700037.02012
Iron (Fe)7439-89-60.167512.400000.91154
Phosphorus (P)7723-14-00.002090.030000.01139
Zinc (Zn)7440-66-60.006980.100000.03798
subTotal6.97956100.0000037.98103
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.66590
FillerSilica -amorphous-7631-86-90.367153.490001.99793
Silica fused60676-86-08.9230684.8200048.55714
PigmentCarbon black1333-86-40.016830.160000.09160
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.61827
Epoxy resin systemProprietary0.167271.590000.91023
Phenolic resinProprietary0.236702.250001.28806
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.11815
subTotal10.52000100.0000057.24728
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00964
Nickel (Ni)7440-02-00.1612391.000000.87738
Palladium (Pd)7440-05-30.014178.000000.07713
subTotal0.17718100.000000.96415
WirePure metalCopper (Cu)7440-50-80.0418496.550000.22770
Pure metal layerGold (Au)7440-57-50.000150.350000.00083
Palladium (Pd)7440-05-30.001343.100000.00731
subTotal0.04334100.000000.23584
total18.37642100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.