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Chemical content 74LV08D-Q100

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Type numberPackagePackage descriptionTotal product weight
74LV08D-Q100SOT108-1SO14142.01271 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935299069118512601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01646
PolymerAcrylic resinProprietary0.0045615.200000.00321
Resin systemProprietary0.002076.900000.00146
subTotal0.03000100.000000.02113
DieDoped siliconSilicon (Si)7440-21-30.59459100.000000.41869
subTotal0.59459100.000000.41869
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.7480497.4700033.62237
Iron (Fe)7439-89-61.175702.400000.82788
Phosphorus (P)7723-14-00.014700.030000.01035
Zinc (Zn)7440-66-60.048990.100000.03450
subTotal48.98742100.0000034.49510
Mould CompoundAdditiveNon hazardousProprietary4.280974.700003.01450
FillerSilica fused60676-86-071.9567679.0000050.66924
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.465076.000003.84830
PigmentCarbon black1333-86-40.182170.200000.12828
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.643384.000002.56553
Non hazardousProprietary3.734464.100002.62967
Tetramethylbiphenyl diglycidyl ether85954-11-61.821692.000001.28277
subTotal91.08450100.0000064.13829
Pre-PlatingPure metal layerGold (Au)7440-57-50.037313.000000.02627
Nickel (Ni)7440-02-01.1477892.300000.80822
Palladium (Pd)7440-05-30.038553.100000.02715
Silver (Ag)7440-22-40.019901.600000.01401
subTotal1.24353100.000000.87565
WirePure metalCopper (Cu)7440-50-80.07267100.000000.05117
subTotal0.07267100.000000.05117
total142.01271100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.