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Chemical content 74LV123BQ

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Type numberPackagePackage descriptionTotal product weight
74LV123BQSOT763-1DHVQFN1621.91184 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352843171151112601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.36439
PolymerResin systemProprietary0.0198419.900000.09053
subTotal0.09968100.000000.45492
DieDoped siliconSilicon (Si)7440-21-30.85796100.000003.91553
subTotal0.85796100.000003.91553
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700036.70881
Iron (Fe)7439-89-60.198062.400000.90388
Phosphorus (P)7723-14-00.002480.030000.01130
Zinc (Zn)7440-66-60.008250.100000.03766
subTotal8.25236100.0000037.66165
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.65189
FillerSilica -amorphous-7631-86-90.434103.490001.98113
Silica fused60676-86-010.5503084.8200048.14886
PigmentCarbon black1333-86-40.019900.160000.09083
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61307
Epoxy resin systemProprietary0.197771.590000.90258
Phenolic resinProprietary0.279872.250001.27723
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.10034
subTotal12.43846100.0000056.76593
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00956
Nickel (Ni)7440-02-00.1906391.000000.86997
Palladium (Pd)7440-05-30.016768.000000.07648
subTotal0.20948100.000000.95601
WirePure metalCopper (Cu)7440-50-80.0520496.550000.23750
Pure metal layerGold (Au)7440-57-50.000190.350000.00086
Palladium (Pd)7440-05-30.001673.100000.00763
subTotal0.05390100.000000.24599
total21.91184100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.