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Chemical content 74LV14ABZ

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Type numberPackagePackage descriptionTotal product weight
74LV14ABZSOT8014-1DHXQFN145.51100 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691129147612601235Bangkok, Thailand; Shanghai, China; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0067160.000000.12172
ImpurityNon hazardousProprietary0.000000.039500.00008
PolymerResin systemProprietary0.0044739.951410.08105
subTotal0.01118100.000000.20285
DieDoped siliconSilicon (Si)7440-21-30.07820100.000001.41889
subTotal0.07820100.000001.41889
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-82.6945097.0000048.89321
Nickel (Ni)7440-02-00.083343.000001.51216
subTotal2.77784100.0000050.40537
Mould CompoundAdditiveNon hazardousProprietary0.076142.900001.38168
FillerSilica fused60676-86-02.3355288.9500042.37932
PigmentCarbon black1333-86-40.003940.150000.07147
PolymerEpoxy resin systemProprietary0.038601.470000.70037
Phenolic resinProprietary0.081663.110001.48173
Tetramethylbiphenyl diglycidyl ether85954-11-60.089803.420001.62942
subTotal2.62566100.0000047.64399
Pre-PlatingPure metal layerGold (Au)7440-57-50.000141.000000.00249
Nickel (Ni)7440-02-00.0124991.000000.22655
Palladium (Pd)7440-05-30.001108.000000.01992
subTotal0.01372100.000000.24896
WirePure metalCopper (Cu)7440-50-80.0042596.550000.07717
Pure metal layerGold (Au)7440-57-50.000020.350000.00028
Palladium (Pd)7440-05-30.000143.100000.00248
subTotal0.00440100.000000.07993
total5.51100100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.