Chemical content 74LV164BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74LV164BQ-Q100SOT762-1DHVQFN1418.52357 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935302547115612601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10058
PolymerResin systemProprietary0.0046319.900000.02499
DieDoped siliconSilicon (Si)7440-21-30.55472100.000002.99465
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700036.41150
Iron (Fe)7439-89-60.166072.400000.89656
Phosphorus (P)7723-14-00.002080.030000.01121
Zinc (Zn)7440-66-60.006920.100000.03736
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.65266
FillerSilica -amorphous-7631-86-90.367153.490001.98206
Silica fused60676-86-08.9230784.8200048.17145
PigmentCarbon black1333-86-40.016830.160000.09087
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.61336
Epoxy resin systemProprietary0.167271.590000.90300
Phenolic resinProprietary0.236702.250001.27783
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.10132
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07473
Nickel (Ni)7440-02-00.4258792.300002.29908
Palladium (Pd)7440-05-30.014303.100000.07722
Silver (Ag)7440-22-40.007381.600000.03985
WirePure metalCopper (Cu)7440-50-80.0428896.550000.23147
Pure metal layerGold (Au)7440-57-50.000160.350000.00084
Palladium (Pd)7440-05-30.001383.100000.00743
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.