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Chemical content 74LV164D-Q100

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Type numberPackagePackage descriptionTotal product weight
74LV164D-Q100SOT108-1SO14142.19482 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300899118612601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01644
PolymerAcrylic resinProprietary0.0045615.200000.00321
Resin systemProprietary0.002076.900000.00146
subTotal0.03000100.000000.02111
DieDoped siliconSilicon (Si)7440-21-30.77660100.000000.54615
subTotal0.77660100.000000.54615
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.7480497.4700033.57931
Iron (Fe)7439-89-61.175702.400000.82682
Phosphorus (P)7723-14-00.014700.030000.01034
Zinc (Zn)7440-66-60.048990.100000.03445
subTotal48.98742100.0000034.45092
Mould CompoundAdditiveNon hazardousProprietary4.280974.700003.01064
FillerSilica fused60676-86-071.9567679.0000050.60434
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.465076.000003.84337
PigmentCarbon black1333-86-40.182170.200000.12811
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.643384.000002.56225
Non hazardousProprietary3.734464.100002.62630
Tetramethylbiphenyl diglycidyl ether85954-11-61.821692.000001.28112
subTotal91.08450100.0000064.05613
Pre-PlatingPure metal layerGold (Au)7440-57-50.037313.000000.02624
Nickel (Ni)7440-02-01.1477892.300000.80719
Palladium (Pd)7440-05-30.038553.100000.02711
Silver (Ag)7440-22-40.019901.600000.01399
subTotal1.24353100.000000.87453
WirePure metalCopper (Cu)7440-50-80.07277100.000000.05118
subTotal0.07277100.000000.05118
total142.19482100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.