Chemical content 74LV164PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LV164PW-Q100SOT402-1TSSOP1460.00889 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300901118812601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.02596
PolymerAcrylic resinProprietary0.0030415.200000.00507
Resin systemProprietary0.001386.900000.00230
DieDoped siliconSilicon (Si)7440-21-30.55472100.000000.92439
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-818.7809297.4700031.29689
Iron (Fe)7439-89-60.462442.400000.77062
Phosphorus (P)7723-14-00.005780.030000.00963
Zinc (Zn)7440-66-60.019270.100000.03211
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39594
Silica fused60676-86-031.0186878.3300051.69014
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100004.02540
PigmentCarbon black1333-86-40.079200.200000.13198
PolymerEpoxy resin systemProprietary3.509358.862005.84805
Phenolic resinProprietary2.339575.908003.89870
Pre-PlatingPure metal layerGold (Au)7440-57-50.014673.000000.02445
Nickel (Ni)7440-02-00.4514692.300000.75232
Palladium (Pd)7440-05-30.015163.100000.02527
Silver (Ag)7440-22-40.007831.600000.01304
WirePure metalCopper (Cu)7440-50-80.07665100.000000.12773
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.