Chemical content 74LV165PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LV165PW-Q100SOT403-1TSSOP1660.73322 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301545118812601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21805
PolymerAcrylic resinProprietary0.0258415.200000.04255
Resin systemProprietary0.011736.900000.01931
DieDoped siliconSilicon (Si)7440-21-30.54356100.000000.89499
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.80002
Iron (Fe)7439-89-60.475552.400000.78301
Phosphorus (P)7723-14-00.005940.030000.00979
Zinc (Zn)7440-66-60.019810.100000.03263
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39122
Silica fused60676-86-031.0186878.3300051.07366
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.97739
PigmentCarbon black1333-86-40.079200.200000.13041
PolymerEpoxy resin systemProprietary3.509358.862005.77831
Phenolic resinProprietary2.339575.908003.85220
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02485
Nickel (Ni)7440-02-00.4642592.300000.76441
Palladium (Pd)7440-05-30.015593.100000.02567
Silver (Ag)7440-22-40.008051.600000.01325
WirePure metalCopper (Cu)7440-50-80.10220100.000000.16828
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.