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Chemical content 74LV1T34GV-Q100

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Type numberPackagePackage descriptionTotal product weight
74LV1T34GV-Q100SOT753SO510.38739 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691086125412601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0075075.000000.07220
PolymerResin systemProprietary0.0025025.000000.02407
subTotal0.01000100.000000.09627
DieDoped siliconSilicon (Si)7440-21-30.07216100.000000.69464
subTotal0.07216100.000000.69464
Lead FrameCopper alloyCopper (Cu)7440-50-83.1906694.9600030.71663
Iron (Fe)7439-89-60.085682.550000.82485
Lead (Pb)7439-92-10.001010.030000.00970
Phosphorus (P)7723-14-00.005040.150000.04852
Tin (Sn)7440-31-50.006720.200000.06469
Pure metal layerSilver (Ag)7440-22-40.070902.110000.68252
subTotal3.36000100.0000032.34691
Mould CompoundFillerSilica fused60676-86-04.6008071.0000044.29217
PigmentCarbon black1333-86-40.019440.300000.18715
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2765619.7000012.28952
Phenolic resinProprietary0.583209.000005.61450
subTotal6.48000100.0000062.38334
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00013
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000020.005000.00021
Tin solderTin (Sn)7440-31-50.4399699.990004.23548
subTotal0.44000100.000004.23590
WireGold alloyGold (Au)7440-57-50.0249899.000000.24046
Palladium (Pd)7440-05-30.000251.000000.00243
subTotal0.02523100.000000.24289
total10.38739100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.