Chemical content 74LV4053BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74LV4053BQ-Q100SOT763-1DHVQFN1621.60902 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935303844115512601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0300060.000000.13883
ImpurityNon hazardousProprietary0.000020.039500.00009
PolymerResin systemProprietary0.0199839.951410.09244
DieDoped siliconSilicon (Si)7440-21-30.60395100.000002.79489
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700037.22323
Iron (Fe)7439-89-60.198062.400000.91655
Phosphorus (P)7723-14-00.002480.030000.01146
Zinc (Zn)7440-66-60.008250.100000.03819
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.67504
FillerSilica -amorphous-7631-86-90.434103.490002.00889
Silica fused60676-86-010.5503084.8200048.82360
PigmentCarbon black1333-86-40.019900.160000.09210
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62166
Epoxy resin systemProprietary0.197771.590000.91523
Phenolic resinProprietary0.279872.250001.29513
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.12977
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00969
Nickel (Ni)7440-02-00.1906391.000000.88216
Palladium (Pd)7440-05-30.016768.000000.07755
WirePure metalCopper (Cu)7440-50-80.0528896.550000.24471
Pure metal layerGold (Au)7440-57-50.000190.350000.00089
Palladium (Pd)7440-05-30.001703.100000.00786
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.