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Chemical content 74LV4053D

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Type numberPackagePackage descriptionTotal product weight
74LV4053DSOT109-1SO16142.75957 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351758601181212601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-42.0025080.100001.40271
PolymerResin systemProprietary0.4975019.900000.34849
subTotal2.50000100.000001.75120
DieDoped siliconSilicon (Si)7440-21-30.84553100.000000.59227
subTotal0.84553100.000000.59227
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-869.2037097.4700048.47570
Iron (Fe)7439-89-61.704002.400001.19362
Phosphorus (P)7723-14-00.021300.030000.01492
Zinc (Zn)7440-66-60.071000.100000.04973
subTotal71.00000100.0000049.73397
Mould CompoundAdditiveNon hazardousProprietary3.196004.700002.23873
FillerSilica fused60676-86-053.7200079.0000037.62970
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.080006.000002.85795
PigmentCarbon black1333-86-40.136000.200000.09527
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.720004.000001.90530
Non hazardousProprietary2.788004.100001.95293
Tetramethylbiphenyl diglycidyl ether85954-11-61.360002.000000.95265
subTotal68.00000100.0000047.63253
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00210
Nickel (Ni)7440-02-00.2910097.000000.20384
Palladium (Pd)7440-05-30.006002.000000.00420
subTotal0.30000100.000000.21014
WirePure metalCopper (Cu)7440-50-80.11405100.000000.07989
subTotal0.11405100.000000.07989
total142.75957100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.