Chemical content 74LV4060PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LV4060PW-Q100SOT403-1TSSOP1660.98874 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300455118712601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21714
PolymerAcrylic resinProprietary0.0258415.200000.04237
Resin systemProprietary0.011736.900000.01923
DieDoped siliconSilicon (Si)7440-21-30.80744100.000001.32392
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.66679
Iron (Fe)7439-89-60.475552.400000.77973
Phosphorus (P)7723-14-00.005940.030000.00975
Zinc (Zn)7440-66-60.019810.100000.03249
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.38958
Silica fused60676-86-031.0186878.3300050.85968
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.96073
PigmentCarbon black1333-86-40.079200.200000.12986
PolymerEpoxy resin systemProprietary3.509358.862005.75410
Phenolic resinProprietary2.339575.908003.83607
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02474
Nickel (Ni)7440-02-00.4642592.300000.76121
Palladium (Pd)7440-05-30.015593.100000.02557
Silver (Ag)7440-22-40.008051.600000.01320
WirePure metalCopper (Cu)7440-50-80.09384100.000000.15386
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.