×

Chemical content 74LVC07ABQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC07ABQ-Q100SOT762-1DHVQFN1418.11400 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935299495115612601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10286
PolymerResin systemProprietary0.0046319.900000.02555
subTotal0.02326100.000000.12841
DieDoped siliconSilicon (Si)7440-21-30.13610100.000000.75133
subTotal0.13610100.000000.75133
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.23479
Iron (Fe)7439-89-60.166072.400000.91683
Phosphorus (P)7723-14-00.002080.030000.01146
Zinc (Zn)7440-66-60.006920.100000.03820
subTotal6.91978100.0000038.20128
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.69003
FillerSilica -amorphous-7631-86-90.367153.490002.02688
Silica fused60676-86-08.9230784.8200049.26064
PigmentCarbon black1333-86-40.016830.160000.09292
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62723
Epoxy resin systemProprietary0.167271.590000.92342
Phenolic resinProprietary0.236702.250001.30673
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.14884
subTotal10.52001100.0000058.07669
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07642
Nickel (Ni)7440-02-00.4258792.300002.35107
Palladium (Pd)7440-05-30.014303.100000.07896
Silver (Ag)7440-22-40.007381.600000.04076
subTotal0.46140100.000002.54721
WirePure metalCopper (Cu)7440-50-80.0516196.550000.28491
Pure metal layerGold (Au)7440-57-50.000190.350000.00103
Palladium (Pd)7440-05-30.001663.100000.00915
subTotal0.05345100.000000.29509
total18.11400100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.