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Chemical content 74LVC138ABQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC138ABQ-Q100SOT763-1DHVQFN1621.55307 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301409115512601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.37045
PolymerResin systemProprietary0.0198419.900000.09203
subTotal0.09968100.000000.46248
DieDoped siliconSilicon (Si)7440-21-30.22312100.000001.03522
subTotal0.22312100.000001.03522
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700037.00018
Iron (Fe)7439-89-60.196362.400000.91105
Phosphorus (P)7723-14-00.002450.030000.01139
Zinc (Zn)7440-66-60.008180.100000.03796
subTotal8.18167100.0000037.96058
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.67939
FillerSilica -amorphous-7631-86-90.434103.490002.01411
Silica fused60676-86-010.5503184.8200048.95038
PigmentCarbon black1333-86-40.019900.160000.09234
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62328
Epoxy resin systemProprietary0.197771.590000.91760
Phenolic resinProprietary0.279872.250001.29850
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.13530
subTotal12.43847100.0000057.71090
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07593
Nickel (Ni)7440-02-00.5035192.300002.33612
Palladium (Pd)7440-05-30.016913.100000.07846
Silver (Ag)7440-22-40.008731.600000.04050
subTotal0.54551100.000002.53101
WirePure metalCopper (Cu)7440-50-80.0623996.550000.28947
Pure metal layerGold (Au)7440-57-50.000230.350000.00105
Palladium (Pd)7440-05-30.002003.100000.00929
subTotal0.06462100.000000.29981
total21.55307100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.