Chemical content 74LVC139PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC139PW-Q100SOT403-1TSSOP1660.38753 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935691605118312601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21930
PolymerAcrylic resinProprietary0.0258415.200000.04279
Resin systemProprietary0.011736.900000.01942
DieDoped siliconSilicon (Si)7440-21-30.18284100.000000.30277
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.98206
Iron (Fe)7439-89-60.475552.400000.78749
Phosphorus (P)7723-14-00.005940.030000.00984
Zinc (Zn)7440-66-60.019810.100000.03281
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39346
Silica fused60676-86-031.0186878.3300051.36604
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100004.00016
PigmentCarbon black1333-86-40.079200.200000.13115
PolymerEpoxy resin systemProprietary3.509358.862005.81139
Phenolic resinProprietary2.339575.908003.87426
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02499
Nickel (Ni)7440-02-00.4642592.300000.76879
Palladium (Pd)7440-05-30.015593.100000.02582
Silver (Ag)7440-22-40.008051.600000.01333
WirePure metalCopper (Cu)7440-50-80.11724100.000000.19414
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.