Chemical content 74LVC161D

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Type numberPackagePackage descriptionTotal product weight
74LVC161DSOT109-1SO16142.31105 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352105101181212601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.025001.000000.01757
FillerSilver (Ag)7440-22-41.8750075.000001.31754
PolymerAcrylic resinProprietary0.150006.000000.10540
Resin systemProprietary0.4500018.000000.31621
DieDoped siliconSilicon (Si)7440-21-30.38483100.000000.27042
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-869.2037097.4700048.62848
Iron (Fe)7439-89-61.704002.400001.19738
Phosphorus (P)7723-14-00.021300.030000.01497
Zinc (Zn)7440-66-60.071000.100000.04989
Mould CompoundFillerSilica -amorphous-7631-86-90.408000.600000.28670
Silica fused60676-86-053.2644078.3300037.42815
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.148006.100002.91474
PigmentCarbon black1333-86-40.136000.200000.09557
PolymerEpoxy resin systemProprietary6.026168.862004.23450
Phenolic resinProprietary4.017445.908002.82300
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00211
Nickel (Ni)7440-02-00.2910097.000000.20448
Palladium (Pd)7440-05-30.006002.000000.00422
WirePure metalCopper (Cu)7440-50-80.12622100.000000.08869
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.