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Chemical content 74LVC16374ADGG-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC16374ADGG-Q100SOT362-1TSSOP48203.95000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300232118612601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2259177.900000.11077
PolymerAcrylic resinProprietary0.0440815.200000.02161
Resin systemProprietary0.020016.900000.00981
subTotal0.29000100.000000.14219
DieDoped siliconSilicon (Si)7440-21-30.85171100.000000.41761
subTotal0.85171100.000000.41761
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-876.6494097.0000037.58245
Nickel (Ni)7440-02-02.370603.000001.16234
subTotal79.02000100.0000038.74479
Mould CompoundAdditiveNon hazardousProprietary5.734004.700002.81147
FillerSilica fused60676-86-096.3800079.0000047.25668
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-87.320006.000003.58911
PigmentCarbon black1333-86-40.244000.200000.11964
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-64.880004.000002.39274
Non hazardousProprietary5.002004.100002.45256
Tetramethylbiphenyl diglycidyl ether85954-11-62.440002.000001.19637
subTotal122.00000100.0000059.81857
Pre-PlatingPure metal layerGold (Au)7440-57-50.015101.000000.00740
Nickel (Ni)7440-02-01.4647097.000000.71817
Palladium (Pd)7440-05-30.030202.000000.01481
subTotal1.51000100.000000.74038
WirePure metalCopper (Cu)7440-50-80.27829100.000000.13645
subTotal0.27829100.000000.13645
total203.95000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.