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Chemical content 74LVC1G125GV-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1G125GV-Q100SOT753SO510.40443 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298477125512601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0075075.000000.07208
PolymerResin systemProprietary0.0025025.000000.02403
subTotal0.01000100.000000.09611
DieDoped siliconSilicon (Si)7440-21-30.08119100.000000.78033
subTotal0.08119100.000000.78033
Lead FrameCopper alloyCopper (Cu)7440-50-83.1906694.9600030.66632
Iron (Fe)7439-89-60.085682.550000.82350
Lead (Pb)7439-92-10.001010.030000.00969
Phosphorus (P)7723-14-00.005040.150000.04844
Tin (Sn)7440-31-50.006720.200000.06459
Pure metal layerSilver (Ag)7440-22-40.070902.110000.68140
subTotal3.36000100.0000032.29394
Mould CompoundFillerSilica fused60676-86-04.6008071.0000044.21963
PigmentCarbon black1333-86-40.019440.300000.18684
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2765619.7000012.26939
Phenolic resinProprietary0.583209.000005.60530
subTotal6.48000100.0000062.28116
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00013
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000020.005000.00021
Tin solderTin (Sn)7440-31-50.4399699.990004.22854
subTotal0.44000100.000004.22896
WireGold alloyGold (Au)7440-57-50.0329199.000000.31633
Palladium (Pd)7440-05-30.000331.000000.00320
subTotal0.03325100.000000.31953
total10.40443100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.