Chemical content 74LVC1G175GS

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Type numberPackagePackage descriptionTotal product weight
74LVC1G175GSSOT1202X2SON60.97951 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935292905132612601235Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04478100.000004.57164
ComponentAdditiveNon hazardousProprietary0.000255.000000.02552
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02552
Silica -amorphous-7631-86-90.0025050.000000.25523
PolymerEpoxy resin systemProprietary0.0015030.000000.15314
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05105
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100040.62104
Magnesium (Mg)7439-95-40.000630.150000.06447
Nickel (Ni)7440-02-00.012422.950001.26793
Silicon (Si)7440-21-30.002690.640000.27508
Pure metal layerGold (Au)7440-57-50.000080.020000.00860
Nickel (Ni)7440-02-00.006901.640000.70488
Palladium (Pd)7440-05-30.000380.090000.03868
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.20552
FillerSilica -amorphous-7631-86-90.001420.290000.14537
Silica fused60676-86-00.4230086.1500043.18450
HardenerPhenolic resinProprietary0.021064.290002.15045
PigmentCarbon black1333-86-40.000930.190000.09524
PolymerEpoxy resin systemProprietary0.042578.670004.34602
WireGold alloyGold (Au)7440-57-50.0175599.000001.79199
Palladium (Pd)7440-05-30.000181.000000.01810
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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